Integrated Spin-On Dielectric Solution

FSI International, Inc. has entered the emerging low-k, spin-on dielectric (SOD) segment of the semiconductor equipment market with its Calypso system.

Based on the Polaris platform, this system can deposit current generations of organic and inorganic films (k = 2.2 to 3.5) with excellent uniformity (< 0.5% three sigma). With its modular architecture, the system can be extended to ultra low-k nano-porous films (k < 2.2) for future technology nodes.

At the heart of the system is a proprietary high-temperature anaerobic bake module that optimizes wafer temperature and oxygen content within the chamber throughout the curing process. This process eliminates the need for a traditional curing furnace, thereby reducing cleanroom space requirements, capital and operating costs, power consumption and WIP (wafers in process) risk.

The system can be extended to accommodate 300-mm wafer processing without increasing the system's footprint. It achieves throughput of more than 100 wafers per hour, independent of film thickness or wafer size, and an MTBF of more than 500 hours. Throughput can be increased as needed by adding more stations.

FSI International, Inc., 322 Lake Hazeltine Drive, Chaska, MN 55318. Tel: 612-4485440. Fax: (612) 448-2825.