Integrated Material for Damascene Interconnect Processes

Shipley Company's new MOSAIC (or Metallization and Organic Solutions for Advanced Integrated Circuits) family of chemical materials, services and support for the manufacture of dual damascene interconnects will soon become a single source for all interconnect materials required in copper deposition, chemical mechanical planarization (CMP), and dielectric deposition. In its MOSAIC offering, Shipley will supply integrated process chemicals such as electroplating chemistries, spin-on dielectrics, photochemistries, etchants/cleaners, and CMP slurries through Rodel. All components in the family will work together as optimized processes, avoiding sub-optimal interactions and ensuring successful process outcomes.

MOSAIC products already released to the market include copper electrolytes, copper plating process control systems, damascene-optimized photoresists and ancillaries, and Rodel's advanced CMP slurries and pads for copper an dielectric polishing.

Shipley Company, 455 Forest St., Marlborough, MA 01752-3001. Tel: 508-481-7950. Fax: 508-485-9113.