Munich, Germany -- After the SEMICON West show where SUSS MicroTec and IBM showed the first bumped wafers using the newly developed C4NP process, SUSS now reports that the first equipment has been shipped on schedule.
IBM, who invented and developed the C4NP technology (Controlled Collapse Chip Connection - New Process) at its TJ Watson Research Center, engaged SUSS in September 2004 to develop the necessary equipment for this revolutionary process. C4NP is a new method of manufacturing solder bumps in which solder-balls are prefabricated in a mold before transferring them onto an entire wafer in one easy step.
"SUSS has met all the checkpoints to date in the Joint Development Agreement with IBM and the C4NP equipment is now available. This will allow access to fine-pitch lead-free solder bumps at a significantly lower cost," said Joe Lisowski, Director, Packaging Applications and Development Group for IBM.
SUSS, who developed the various tools at different sites and integrates them at their Waterbury, VT facility, recently hosted a select group of companies for a "C4NP Equipment Preview" in Vermont. This was the first time that key technology leaders were able to take a direct look at the equipment and have their questions answered. "We are now moving into a very exciting phase in the C4NP project." comments Dr. Stefan Schneidewind, CEO of SUSS MicroTec. "The equipment is being set up in the Hudson Valley Research Facility right now and the line will open for interested parties to view and evaluate as scheduled in September."
SOURCE: SUSS MicroTec