Product/Service

In-Line Metrology System

Source: Boxer Cross, Inc.
Boxer Cross, Inc. offers the world's first metrology system for measuring ultra-shallow junctions critical to the performance of 0.18 micron and smaller devices.
Boxer Cross, Inc. offers the world's first metrology system for measuring ultra-shallow junctions critical to the performance of 0.18 micron and smaller devices. The BX-10 Advanced Implant Monitor enables development and process control of ultra-low energy implant and rapid thermal anneal processes used to form the transistors that determine electrical performance in advanced devices.

Differing from competitive metrology systems, this laser-based tool enables non-contact, non-destructive junction depth measurements previously only possible by slow or destructive methods. The rapid process feedback eliminates the time lag associated with traditional analytical lab or end-of-line electrical test methods. As a result, the BX-10 can help chipmakers accelerate process development of 0.18 micron and smaller devices, thus speeding time-to-market for these leading-edge products.

According to the 1998 International Technology Roadmap, the 0.18 micron device generation requires junction depths of 70-140 nanometers for source/drain implants and 36-72 nanometers for extension implants. This creates unprecedented process control challenges, since these depths are 50-100 percent shallower than for 0.25 micron devices. To successfully form these regions, chipmakers must have precise control over both the ion implantation and RTA processes.

Existing in-fab methods used to monitor implants have either sensitivity limitations or can only be performed on test wafers. Although analytical lab methods are also widely used, they are extremely slow, destructive and operator-dependent, and lab queues are often days or weeks. As a result, detailed wafer information can be prohibitively expensive and it is not feasible to implement the analytical methods for manufacturing process control. The BX-10 measurement can be made automatically at user-selectable sites to map process variation across the wafer within minutes.

Designed from the ground up for use in volume production operations, the BX-10 platform is fully automated, offering pattern recognition and compliance with industry standards for CE, automation, ergonomics and safety. With these capabilities and its 300 mm extendibility, the system can be rapidly transferred into production, where the feedback can be used to accelerate the production ramp and subsequently maintain process control of today's advanced sub-quarter micron devices.

Boxer Cross, Gale Lane, Tel: 650-470-0330. Fax: 650-470-0335. E-mail: glane@boxercross.com.