In-Line Etch Monitoring System
Source: KLA-Tencor
Model HRP-240ETCH is an in-line etch monitoring system designed to provide topography-related measurements in the production of copper devices
KLA-Tencor40ETCH is an in-line etch monitoring system designed to provide topography-related measurements in the production of copper devices. The system measures post-etch depth of high aspect ratio structures associated with dual damascene and offers global measurement capability for post-chemical mechanical planarization (CMP) applications. It is also suited for use in applications with design rules to 0.15 micron, such as shallow trench isolation (STI) etch depth. The system incorporates dual-stage scanner technology for both macro and micro scanning, and quick transition from high to low magnification when viewing samples.
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