IDI Introduces Synergetix Wafer-Level CSP Interposers

Kansas City, KS - Interconnect Devices Inc., the world's leading manufacturer of spring contact probes, test sockets, and custom interconnect solutions announces the official release of Synergetix interposers for Wafer-Level Chip Scale Package (WLCSP) Testing.

The Synergetix test socket interposers are revolutionizing the testing of WLCSPs in vertical probing applications. With this technology rapidly emerging, IDI delivers a highly reliable, easily maintained, and eminently capable solution.

IDI interposers have a remarkably low cost of ownership beginning with their initial cost. The interposer consists of a plastic assembly containing IDI's proven semiconductor probe technology. Combined with an easy to design and fabricate load board, interposers require minimal attention throughout their extended life cycles.

WLCSP interposers are now available for use and feature several other significant benefits including:

• Lower initial investment
• Easy set-up and maintenance
• Extremely linear compression against the wafer leading to a longer mechanical life
• Particularly well suited for high current applications
• Average cleaning cycle every 50,000 touchdowns
• Contact replacement is rarely necessary before 500,000 tests

WLCSP Interposers have transformed the testing of WLCSP vertical probing applications to a new precedence compared to traditional technologies," stated Mike Kirkman, President and CEO.

SOURCE: Interconnect Devices, Inc.