Honeywell Invests Over $1 Million In Semiconductor Packaging R&D Facility

Tempe, AZ -- Honeywell Electronic Materials announced it will expand its Spokane, Washington research and development center, which is dedicated to developing critical advanced packaging materials for semiconductor manufacturers, including thermal management, electrical interconnect, and burn-in materials.

The announcement was made at the third annual Thermal Management Symposium presented by the Microelectronics Packaging and Test Engineering Council (MEPTEC), held in San Jose, CA. Honeywell's leading thermal management expert is a featured presenter at the event, which explores potential solutions to thermal management challenges in the semiconductor manufacturing industry.

As part of the expansion, Honeywell will invest more than $1 million in the facility and equipment. The project, to be completed by the end of 2007, will add approximately 85 new pieces of state-of-the-art equipment, allowing for expanded and enhanced thermal interface material mixing and characterization, analytical and application testing, thermal and reliability testing, and failure analysis. The expansion will also include a complete metrology lab, allowing Honeywell to replicate customer manufacturing obstacles and test for solutions.

"Honeywell is committed to developing next-generation materials that help semiconductor manufacturers manage the tremendous heat put off by advanced microchips," said Rebecca Liebert, vice president and general manager of Honeywell Electronic Materials. "Overcoming this challenge is crucial to allowing manufacturers to make chips ever more powerful and smaller."

SOURCE: Honeywell Electronic Materials