High-Temperature Electrostatic Chuck

Trikon Technologiesvanced high-temperature electrostatic chuck is now available for plasma etching compound semiconductors. This new electrostatic chuck is designed for the plasma etching of materials such as indium phosphide, used throughout the optoelectronics industry.

The new technology products for compound and wireless semiconductor manufacture include:

Sigma fxP PVD: A metalization system offering high throughput and reliability with advanced process modules for lift off metalization, ultra high uniformity sputtering for acoustic wave devices and low temperature sputtered high k dielectrics.

Planar fxP Low K Flowfill: An advanced low-k dielectric deposition system capable of both gap-fill and planarization enabling the low-k advantage of increased device speed to be brought to existing aluminum
metalized devices.

Omega M0RI: An advanced high-density plasma etch chamber on a small footprint platform. The Omega etcher can be configured with two chambers offering plasma etching and dedicated post etch processing.

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