High Speed Automated Bump Inspection System
The system features optimized hardware and software specifically configured for the inspection of wafer bumps. This tool presents a complete solution to the wafer level packaging industry, including wafer bump, flip chip and chip scale packaging manufacturers. The NSX B-100 inspects for all common bump defects, including but not limited to bump presence, diameter, shape, placement, and defects on bumps. For enhanced process control, the built in bump metrology and positional automated defect classification (ADC) feature allows for the highest level of data analysis. Due to the unique handling requirements of the back-end, the NSX B-100 inspects whole wafers and sawn wafers on film frame, and die in gel/waffle packs, JEDEC trays, MCMs, Auer boats and other package configurations.
Micro level (0.5+ micron) defect inspection of the finished wafer or individual die, is becoming an essential aspect of the semiconductor manufacturing process. With the NSX B-100, the company presents chip manufacturers, foundries and companies offering post-fab manufacturing and assembly services, an attractive solution for high-volume, 100% defect inspection. The system makes use of the high-speed processing engine from the NSX-100 to offer an inspection time of less than 60 seconds in a typical 8 in. wafer bump inspection application.
August Technology, 5237 Edina Industrial Blvd., Edina, MN 55439. Tel: 612-820-0080. Fax: 612-820-0060.