Gold Ball Wire Bonder
ASM's new model AB339 is running on devices with 50 &$181; pad pitch
Featured at Semicon West '98
ASM's new model AB339 is running on devices with 50µ pad pitch. This capability is a standard feature on the AB339. This new model replaces the model AB309A. The AB339 offers higher throughput with a smaller footprint, giving output/square foot that is at least 80% higher than previous generation bonders.
ASM Pacific Assembly Products, Inc., 97 E. Brokaw Rd., Suite 100, San Jose, CA 95112-4209. Contact: Jerry Dellheim, 408-451-0804; Fax: 408-451-0808.