Gel-Frames

Gel-Frames is a new product to meet the semiconductor industry's requirement to optimize die sorting and bonding equipment. It has the capability to accommodate traditional bare die handling along with the need for newer wafer-level packaging for die bonding operations.

The product uses the company's proprietary GEL elastomer. The gel is laminated onto a membrane, which can then be assembled to any standard dicing frame, including those for 300 mm wafers. The result is a Gel-Frame that can store a large custom array of die and is compatible with any assembly equipment. The frame can be configured to release the die by standard pin ejection with reduced force or by using the company's patented vacuum release technology.

This carrier creates an ideal situation for handling multibin parts. Devices can be binned by automated die sorters and placed onto the frames to create 100% KGD (Known Good Die) wafers of each bin type. The frames can then be shipped directly to the assembly operations or stored for later assembly. The frames loaded with repopulated KGD wafers enable automated die bonding equipment to pick 100% of the die, thus increasing the bonder throughput by avoiding the need to step over bad die or die of a speed sort that is not needed for that bonding operation.

"Die chipping" can be eliminated because the flexible wafer frame format allows die to be placed in the best configuration for the type of assembly equipment being used. The product can be bar-coded and has the capability to be used for shipping or long term storage. Once emptied, it can return directly to the die sorting process and each frame can be used multiple times without stripping and rebuilding.

GEL-PAK, 756 N. Pastoria Ave., Sunnyvale, CA 94086. Tel: 408-733-1313. Fax: 408-730-1947.