Freescale Selects Cabot Microelectronics' Epic D100 Cmp Polishing Pad
Cabot Microelectronics and Freescale collaborated on the qualification, adoption and product ramp up for the Epic D100 pad technology. After an extensive evaluation that included on site trials and quality audits of Cabot Microelectronics' manufacturing processes and facilities, Freescale has selected the Epic D100 pad for various manufacturing processes at its wafer fabrication factories. Since its adoption six months ago, the Epic D100 pad has been running successfully in production.
"We worked extensively with Cabot Microelectronics to ensure the successful adoption of the Epic D100 CMP polishing pad and are pleased with the results we see in our manufacturing process," said Grant McEwan, CMP Process Engineering Section Manager, for Freescale's Austin Technology and Manufacturing Center. "The Epic D100 has proven to be cost-effective and durable. We intend to use it for multiple applications."
Dinesh Khanna, Cabot Microelectronic's Global Pads Business Director stated, "Customer collaboration is critical to our development and commercialization process. We are pleased that a world-class company like Freescale elected to partner with us and ultimately chose the Epic D100 for its CMP manufacturing process. We believe the Epic D100 represents a step change advantage in CMP polishing performance. As the industry leader in CMP slurry research and manufacturing, we intend to continue to devote the research and development necessary to develop products that provide maximum performance with the lowest possible cost of ownership."
ABOUT THE EPIC D100 CMP POLISHING PAD
The Epic D100 pad is based on proprietary technology and a state-of-the-art manufacturing process designed to improve pad performance and significantly lower cost-of-ownership. The Epic D100 has demonstrated significantly longer pad life than a conventional pad due to its material characteristics. The design features a single polymer material and is produced via a continuous single-sheet manufacturing process. This is designed to eliminate batch-to-batch and pad-to-pad inconsistencies found in a conventional pad. The Epic D100 can be customized to match customer grooving requirements in facilities located in the United States and Asia. The Epic D100 pad is available for 200mm and 300mm wafer polishing, with or without a window to detect the polishing end point. Cabot Microelectronics is establishing manufacturing capabilities to support worldwide customer demand for the Epic D100 with manufacturing capability for the production of 400,000 intermediate CMP pads annually.
SOURCE: Cabot Microelectronics Corporation