Flip Chip Package

ST Assembly Test Services, Inc. (STATS) mall-Thin Plastic Ball Grid Array (FCstPBGA) features a smaller footprint, which means the package approximates the size of the chip itself, shrinking size and weight. With Flip Chip integrated circuits (IC), designers can place more ICs into a smaller area, allowing more die per wafer. FCstPBGA benefits also include enhanced electrical and thermal performance and reduced costs.

The flip chip assembly process consists of connecting the IC device directly to the substrate via solder balls, eliminating wire bonding. The shorter electrical path reduces interference and the likelihood of cross talk. Flip chip packaging can increase the electrical performance by 10X, compared to standard wire bond technology. In addition, the entire IC surface can be used for interconnectivity, allowing for higher I/O per unit area.

IC packaging technology is tailoring to advanced semiconductor devices, particularly wireless handheld devices such as handphones and personal digital assistants (PDAs), and helps to address time-to-market pressures. The FCstPBGA's area-efficiency and high electrical performance properties make it an ideal packaging technique for mobile station modem (MSM) and base-band analog (BBA) integrated circuits used to process sound in wireless handheld devices.

<%=company%>, 1450 McCandless Drive, Milpitas, CA 95035, Tel: 408-941-1500, Fax: 408-941-1501