Product/Service

Flip Chip Bonder

Source: Besi Die Handling
The model CDB-50 semi-automated flip chip bonder is a granite based machine designed to perform chip bonding in both prototype and pre-production modes
Besi Die Handlingodel CDB-50 semi-automated flip chip bonder is a granite based machine designed to perform chip bonding in both prototype and pre-production modes. The system, which is geared to handle chips up to 1" in size, is capable of placing die from different types of die carriers onto substrates up to 10" by 10" in size. The system utilizes pictorial software and an optical probe.

Features:

  • Bonding accuracy +/- 2 microns
  • Bonding force up to 100Kg
  • Planarity system
  • Tool changer
  • Waffle pack feed
  • Chip orienter
  • Dispensing option
  • UV curing option
  • IR of thermode pulsed heat option
  • Multi-tasking windows system

    • <%=company%>, 121 Ethel Road West, Piscataway, NJ 08854. Tel: 732-572-4800. Fax: 732-572-4808.