FIB Solution

FEI Companya Focused Ion Beam (FIB) copper milling process for advanced circuit edit. Combined with gas chemistry, it delivers uniform milling rates regardless of how the copper interconnect is produced.

CoppeRx was developed in cooperation with leading semiconductor manufacturers and is the industry's first FIB circuit edit solution for copper. It will address the needs of the growing number of designs now being produced in copper.

Typical multi layer copper parts use the top layer(s) for power and ground buses that cover most of the chip below. To gain access to lower level structures for circuit edit,
engineers must first clear away relatively large areas of copper. Smooth milling, as provided by CoppeRx, is critical in creating a flat bottom crater without milling randomly into lower level structures.

FEI Companypart of FEI's suite of Structural Process Management solutions, helping manufacturers control the complex structures found in today's semiconductors and manage the processes that create them.

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