FEI Launches FIB Platform For Design Debug, Failure Analysis And Sample Prep
The rapid time-to-data for defect analysis and shortened cycles for device debugging provided by FEI's FIB and DualBeam (FIB/SEM) tools help semiconductor manufacturers finalize chips designs and achieve full production ramps faster and more efficiently. The results are lower costs and accelerated time to market.
The V600FIB replaces FEI's FIB 200 which, with more than 200 systems installed worldwide, has earned a reputation for its reliability and versatility for mid-range, high-volume semiconductor lab applications. The platform joins FEI's VectraVision™, currently recognized as the most advanced circuit edit platform for sub-90 nm technology nodes. The V600FIB features FEI's Sidewinder 30kV ion column, a versatile gas delivery system to suit specific application requirements, and a 5-axis tilt stage for stable site-specific cross sectioning for failure analysis applications. The system also accommodates a variety of samples from packaged parts to eight inch wafers.
The first V600FIB, the initial system available on the new platform, has already shipped to Philips Semiconductors in Nijmegen, the Netherlands. Philips semiconductors has long-standing experience with FEI lab tools and plans to use the V600FIB as a multiple-user, high throughput circuit edit FIB.
"The V600FIB will provide users with new levels of performance across multiple high-throughput applications," said Tony Edwards, vice president and general manager for FEI's NanoElectronics Laboratory Business. "With its designed-in upgradeability, the V600 FIB will give customers greater flexibility in planning and managing their equipment assets as they progress through rapidly shrinking design nodes."
SOURCE: FEI