Fast Thermal Processing System (FTPS)
The heart of the system is a highly responsive heating element that allows the FTPS to ramp wafers up to process temperature at rates as high as 100° C/minute, with cool-down rates as high as 60° C/minute. With a shortened time for temperature ramping and stabilization, the FTPS reduces the overall process cycle time and increases throughput. The total time at temperature is also reduced, which benefits processes with thermal budget constraints.
The unique capabilities of the FTPS have been used to improve the performance of critical films for high performance logic and memory applications. For example, fast temperature ramping allows the wafers to be inserted into the furnace at a low temperature. This provides better control of the reactions on the wafer surface during the initial stages of the furnace process, which results in measurably better film uniformity and electrical performance. Also, fast temperature ramping allows multiple thermal processing steps to be performed sequentially in the same furnace. This can improve the physical and electrical properties of the materials, and shortens the overall cycle time required to produce multi-layered film stacks. The FTP provides a cost-effective, manufacturable solution for the semiconductor industry's advanced technology needs.
Tokyo Electron America, Inc., 2400 Grove Blvd., Austin, TX 78741. Tel: 512-424-1000; Fax: 512-424-1034.