Fairchild Semiconductor's Family Of UltraFET Devices In MLP 3x3 For DC/DC Converter Designs

South Portland, ME - Expanding its broad portfolio of power switch solutions, Fairchild Semiconductor announced new 100V, 200V and 220V N-channel UltraFET devices available in ultra-compact (3mm x 3mm) molded leadless packages (MLP). These devices are believed to be ideal for primary-side switches in isolated DC/DC converter applications, such as work stations, telecom and networking equipment, where improving system efficiency and saving board space are mandatory design goals.

According to Fairchild:

• The 200V device, the FDMC2610, boasts the industry's lowest Miller charge (3nC vs. 4nC) and the lowest on-resistance (218mOhms vs. 240mOhms) when compared with similar 200V MLP 3x3 devices on the market. These characteristics result in a 25 percent better Figure of Merit (FOM) and translate into superior thermal and switching performance in DC/DC converter applications.
• The 200V device also offers best-in-class thermal resistance (Theta JC) compared with similarly packaged devices (5C/W vs. 25C/W), a heat-dissipating feature that ensures reliability even in demanding environments.
• In addition to offering superior thermal and switching performance over similarly packaged MLP devices on the market, Fairchild's UltraFET devices consume 50 percent less board space than SO-8-packaged devices typically used in DC/DC converter designs. This package-size-reduction enables engineers to design smaller, higher-density DC/DC converters by reducing the MOSFET footprint area and enhancing package thermal capability.
• To complement this offering of three N-channel devices, Fairchild also introduces a 150V P-channel planar UltraFET device, which is also available in an MLP 3x3. This device option offers designers a complete solution for their active-clamp switch topologies requiring both N- and P-channel MOSFETs.
• These lead (Pb)-free devices meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020C and are compliant with European Union regulations now in effect.

"Fairchild now offers designers ultra-compact MLP 3x3 power switches with industry-leading performance," said Mike Speed, Fairchild's market development manager, communications. "We've combined the advantages of our PowerTrench® process and advanced packaging technology to enhance Fairchild's UltraFET portfolio. These products are especially tailored to meet demanding design challenges posed by today's DC/DC converter applications." To contact Fairchild Semiconductor about these products, you can go to http://www.fairchildsemi.com/cf/sales_contacts/. For datasheets of these products in PDF format, you can go to:

• http://www.fairchildsemi.com/ds/FD/FDMC2674.pdf
• http://www.fairchildsemi.com/ds/FD/FDMC2610.pdf
• http://www.fairchildsemi.com/ds/FD/FDM3622.pdf
• http://www.fairchildsemi.com/ds/FD/FDMC2523P.pdf

SOURCE: Fairchild Semiconductor