eSilicon To Design And Manufacture Rim Semiconductor's Cupria Processors
eSilicon will manage the physical implementation and manufacture of the application-specific standard product (ASSP) version of the Cupria Cu5001 device, including test program development, device test, packaging and shipment of the packaged, tested parts. eSilicon's manufacturing partner, Taiwan Semiconductor Manufacturing Company (TSMC), will fabricate the Rim Semi chip.
"Among the many reasons we chose eSilicon is the exceptional quality of its design team. Their ‘roots' in Bell Labs help to explain their unique skills in both design and methodology," said Brad Ketch, president and CEO of Rim Semi. "We welcome eSilicon as a new shareholder, and believe our combined capabilities will enable the rapid development and delivery of cost-efficient devices that meet our customers' needs."
"Rim Semi's innovative broadband technology, which increases the capacity of existing telephone networks, will provide the telecommunications market with a state-of-the-art solution for high-speed data applications," said Jack Harding, chairman, president and CEO of eSilicon Corporation. "We are very excited about Rim Semi's market opportunity and are pleased to become an equity partner."
The Cupria family of copper transport processors is based on Rim Semi's innovative Internet Protocol Subscriber Line (IPSL) technology. The devices deliver significantly more bandwidth over longer distances, increasing the total available market for triple play services while lowering network costs. According to the companies, the IP-based technology offers a better end-user experience than other video-over-copper technologies to deliver superior image quality.
For more information, you can visit www.esilicon.com and www.rimsemi.com
SOURCE: Rim Semiconductor Company