Product/Service

ESC/Apollo 3000

Source: ESC International (Equipment for Semiconductors)
ESC/Apollo 3000 Die Bonder for Matrix BGAs, PBGAs, TBGAs, Mini-BGAs, SBGAs in flat boats PLUS any metallic leadframes.
Features:
  • Placement accuracy of +/- 25m
  • PRS Vision Target Alignment for individual sites on matrix arrays
  • Toolless product changeover
  • Die range - 40 mils to 1,200 mils
  • High speed epoxy writing, single shot or multi-strike dispensing
  • 300mm wafer capable
ESC/Apollo 3000 Die Bonder for Matrix BGAs, PBGAs, TBGAs, Mini-BGAs, SBGAs in flat boats PLUS any metallic leadframes. Available with moving cameras, moving pedestals, programmable BLT and much more.

ESC International (Equipment for Semiconductors), 4 Ivybrook Boulevard, Ivyland, PA 18974-1700. Tel: 215-682-9300; Fax: 215-682-9318.