Epi xP Centura System
According to Rose Associates, a market research firm, the market for 200mm epi wafers is expected to grow in a four year period (1999-2003) at a combined annual rate of 32 percent, with consumption expected to rise from 487 msi (millions of square inches) in 1999 to 1,469 msi by 2003.
In addition to more than 10 new features that maximize system performance and provide a reduction in equipment and process COO (cost of ownership) of more than 30 percent, the Epi xP Centura introduces an integrated oxidation process called FLO-Zone. Traditionally wafers were taken from the epi system to be wet cleaned and oxidized in another system. These additional steps were needed to remove built-up contamination from the cassette case and cleanroom environment. With the Epi xP, a clean oxide layer is deposited on the wafers while they are still in the system, directly following the epi process, potentially reducing post-epi cleaning costs by more than 90 percent.
Standard configuration of the Epi xP Centura is with three process chambers for maximum productivity and minimum floorspace. Customers with existing Epi Centura systems can also benefit from a new package that retrofits a third chamber to their two-chamber systems with new Epi xP features. The company is also developing a production-worthy 300mm version of this system.
Volume shipments of the Epi xP Centura are scheduled to begin in the spring of 2000. The Epi xP Centura's enhancements, including FLO-Zone technology, have already been placed in beta site production by wafer suppliers and chipmakers in the U.S., Europe and Japan.
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