Entegris Offers Industry's First 300mm FOUP Certified To FM4911 By FM Approvals
Chaska, MN - Entegris, Inc. announced recently that the new configuration of its Spectra Front Opening Unified Pod (FOUP), used for transporting 300mm wafers in the fab environment, has received FM4911 certification from FM Approvals, a leading product testing and certification organization. FM Approvals certification indicates a product or service has been objectively tested and conforms to the highest national and international standards for loss prevention.
The Entegris Spectra FOUP is the culmination of significant research and development into materials, design and processes that can meet the stringent requirements defined by FM Approvals for fire safety in fabs. The Entegris Spectra FOUP means chipmakers can greatly reduce their risk for catastrophic fire and potentially reduce insurance rates. The new FOUP configuration also means costs for fire protection systems can be lower when building new fabs.
The FOUP passed the testing criteria published in the FM4911 Approval Standard, 'Wafer Carriers for Use in Clean Rooms.' The standard sets stringent performance requirements by evaluating the ability of these carriers to limit fire spread and smoke damage. Wafer carriers not FM Approved and currently in use are fabricated from materials that may be considered a fire hazard and require special fire protection.
"We are pleased that our research and development into advanced product design and molding techniques resulted in certification from FM Approvals and now offers chip makers a unique opportunity to benefit the bottom line with this new certified FOUP," said Bill Shaner, vice president and general manager, Microenvironments, Entegris. "Our ability to comprehensively address industry challenges through innovative product design, expertise in polymer engineering and materials science, and advanced molding / manufacturing technologies is what uniquely positions Entegris to best help customers enhance their yields and improve overall fab performance."
The newly FM Approved FOUP also offers customer benefits beyond FM Approvals certification. Earlier this year, Entegris was issued Japanese Patent No 4150465 entitled "Wafer Carrier and its Manufacturing Method" that applies to critical overmolding technology enabling wafer carriers / shippers to have attractive strength characteristics and durability at a reasonable cost. The technology also provides improved performance for kinematic couplings and lower particle generating wafer supports. Patents for the technology have issued in all major semiconductor manufacturing nations including China, Taiwan, South Korea, Singapore, Germany, Italy, France, Great Britain, Malaysia and the United States. This patented technology is used in the newly-certified Spectra configuration.
SOURCE: Entegris, Inc.