Enhanced Chemical Vapor Deposition System
Source: Applied Materials, Inc.
Ultima HDP-CVD Plus Centura system is an enhanced version of the Ultima HDP-CVD (high density plasma - chemical vapor deposition) technology
Applied Materials, Inc.a HDP-CVD Plus Centura system is an enhanced version of the Ultima HDP-CVD (high density plasma - chemical vapor deposition) technology. Featuring a new high-efficiency remote plasma source and speedy cVHP+ robot, the new system increases system throughput while offering technology extendibility below 0.13 micron.
The system features a remote plasma source for chamber cleaning. The source integrates power delivery and ion plasma source technologies to provide a highly efficient reaction with minimal component degradation. The source reduces system clean time and NF3 consumption by more than 40 percent, enabling up to a 10 percent increase in chamber throughput and lower gas cost.
The system features a remote plasma source for chamber cleaning. The source integrates power delivery and ion plasma source technologies to provide a highly efficient reaction with minimal component degradation. The source reduces system clean time and NF3 consumption by more than 40 percent, enabling up to a 10 percent increase in chamber throughput and lower gas cost.
The blade cVHP+ robot also contributes to system productivity, providing an additional increase in throughput. The robot's secure wafer capture system boosts rotation speed by 3x for improved sequencing and faster wafer swap time.
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