EMCEP : EMI Management

As microelectronic clock frequencies continue to rise the resulting harmonic frequencies produce significant electromagnetic interference or EMI. Most electronic systems today are required to meet the FCC's Class A and B standards as well as Europe's CISPR 22 Class A and B standards for both radiated and conducted emissions.

Coupling paths for electromagnetic energy are difficult to identify even when the source and receptor are known. There may be multiple coupling paths where upon steps taken to attenuate one path may amplify another.

INCEP has patents pending on technologies in EMI Management with Circuit Encapsulated Packaging referred to as EMCEP. INCEP uses its Foundation structure to encapsulate semiconductor devices and provide an extremely high shielding effectiveness. This superior approach provides a common-mode current shunt to ground while preserving continuity in the device shield.

The INCEP EMI containment methodology is inherently a Faraday shield which may provide shielding effectiveness up to 100 dB while providing the necessary thermal and power distribution paths.

• Containment of radiated emissions for operating frequencies from 10MHz to 10GHz.
• Shielding effectiveness up to 100 dB.
• Spread-spectrum clocking or elaborate containment mechanisms often not required.
• Board-level containment reduces chassis excitation and, therefore, the need expensive chassis-level solutions.
• Cable emissions are reduced due to low impedance shunt paths.
• Aperture sizes no longer constrained thereby providing more flexibility in the thermal solution.
• EMI solution integrated with INCEP's thermal and power solutions.

INCEP Technologies, Inc., 10650 Treena Street, Suite 308, San Diego, CA 92131. Tel: 858--547-9925; Fax: 858-547-9926.