Product/Service

Electrostatic Chucks

Source: AJA International
The Semco electrostatic chuck pulls with a uniform force across the entire wafer
A common problem with mechanical clamping is wafer bowing. When the wafer is mechanically clamped and the cooling gas is injected, the center tends to bow upward. This upward bowing creates a larger gap between the chuck and the center of the wafer, reducing the effectiveness of heat transfer and temperature uniformity. The Semco electrostatic chuck pulls with a uniform force across the entire wafer, allowing it to sit completely flat. As a result the gap between the wafer and the chuck is smaller and uniform, which allows for excellent thermal uniformity.

MODELS AVAILABLE

  • Temperature ranges from -200° to 650°C
  • 200mm & 300mm wafer sizes
  • Bipolar & multi-polar designs
  • Integrated heating or cooling available
  • RF biasable

    TYPICAL APPLICATIONS

  • Micromachining
  • Plasma etching
  • HDPCVD, PECVD, CVD, LPC
  • Sputtering
  • HDP Etching

    Please contact AJA International for additional features and technical specifications.

    AJA International, 809 Country Way, Box 246, N Scituate, MA 02060. Tel: 781-545-7365; Fax: 781-545-4105.