Product/Service

ElectroChemical Plating System

Source: Applied Materials, Inc.
Millennia Electra ECP (ElectroChemical Plating) system has been designed for the volume manufacturing of high-speed copper-based semiconductor chips featuring innovations in chemical management technology, chemistry and equipment architecture

Millennia Electra ECP (ElectroChemical Plating) system has been designed for the volume manufacturing of high-speed copper-based semiconductor chips featuring innovations in chemical management technology, chemistry and equipment architecture. The system's computer-controlled, closed-loop chemical management system continuously analyzes and automatically controls the electrolyte and additive chemistries to specified levels. It is capable of keeping the solution to within parts-per-million accuracy at all times, enabling repeatable results wafer after wafer.

This system has two twin-cell electroplating modules, serviced by a dual-blade wafer handler. The system's platform can be expanded with a third twin-cell process module for additional capacity or for other future technologies. Both 200mm and 300mm wafers can be accommodated on the platform with no change in footprint.

Applied Materials, Inc., 3050 Bowers Avenue, Santa Clara, CA 95054-3299. Tel: 408-727-5555. Fax: 408-748-9943.