E200
Source: SCP Global Technologies
SCP introduces the E200, a unique combination of process innovations and modularity design expertise
SCP introduces the E200, a unique combination of process innovations and modularity design expertise. The E200 is a linear wet bench that offers both traditional and innovative solutions to wet surface preparation. The E200 provides the industry with world class process performance on a platform that utilizes design innovations to set industry standards for lead time, installation time, footprint reduction, quality, and process capability.
EVOLUTION 200 Features:
- GreenDry CI (Chemical Inject) capable of HF, HCl, or ozone inject for cleaning and silicon surface preparation with integrated rinse/dry
- Industry's best dryer particle performance:
- 0 particles @ 0.12µ and 0.09µ on hydrophilic wafers
less than 5 particle adders @ 0.12µ on hydrophobic wafers
- 0 particles @ 0.12µ and 0.09µ on hydrophilic wafers
- HF & SC1 ProRinse 32" Module
- Recirculated HF, rinse and megasonic SC1 particle removal in a two tank, 32" process module
- Industry's first truly modular construction
- Fire-safe materials
- Slide mount components for manufacturability and serviceability
SCP Global Technologies, 400 Benjamin Lane, Boise, ID 83704. Tel: 208-377-9700; Fax: 208-375-4540.