DUV-Wavelength Reticle Inspection Tool

KLA-TencoreraScan 570 system is a high-throughput, deep ultraviolet (DUV) wavelength inspection platform designed to capture pattern defects generated during advanced reticle manufacturing at the 0.13-micron node and below. The platform can detect defects as small as 100 nm and provides reticle-to-integrated circuit (IC) design data inspection capabilities to enable the production of the most advanced ICs, including microprocessors for high-end server applications such as enterprise-wide information technology systems.

The new DUV system, is designed to inspect reticles used for 248 nm and 193 nm lithography applications and delivers both the speed and sensitivity required to capture the new defects associated with these reticle enhancement techniques.

The platform utilizes a multiple parallel sensor array illuminated by a non-linear, crystal frequency-doubled, argon-ion laser to deliver DUV wavelength inspection. The tool incorporates an image computer that allows the tool to achieve a 200 million pixel-per-second inspection rate and enables the use of proprietary algorithms to provide both die-to-die and die-to-database inspection with better than 100 nm sensitivity.

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