DuPont Appoints Fraunhofer IZM As Partner In Applications Development

Research Triangle Park, NC -- DuPont Semiconductor Packaging & Circuit Materials announced an applications development agreement with the Fraunhofer Institute for Reliability and Microintegration IZM. Fraunhofer will assist in refining and optimizing the process of use for the new and growing line of DuPont materials in wafer level and chip scale packaging.

DuPont materials for semiconductor packaging currently include polyimide-based dielectric materials for redistribution, passivation and stress buffering from joint venture HD Microsystems; Microlithographic Polymer Films composed of temporary and permanent photoimageable dry films for applications such as wafer bumping, backside wafer coating, other wafer level packaging and microelectromechanical systems (MEMS) applications; and a line of cleaners and removers from DuPont EKC Technology. The purpose of the agreement with Fraunhofer is to ensure faster integration of materials as the DuPont offering for packaging applications continues to expand.

"As the growth of wafer level packaging accelerates, our customers face increasingly demanding requirements," said Peter A. Irvine, global business director, DuPont Semiconductor Packaging & Circuit Materials. "DuPont is putting science to work to develop and apply highly engineered materials for critical applications, and we are very pleased to be working with Fraunhofer IZM. They will be instrumental in helping us ensure these materials are tailored to meet the real packaging needs of true leading edge fabricators."

"Fraunhofer IZM has a great deal of experience and leadership in system integration technologies, wafer processing and MEMS technologies, materials and reliability, design and sustainable system development," said Dr. Michael Toepper, head of group microlithography and thin film polymers at Fraunhofer IZM . "Our main objective is to support companies in the broad application of microelectronic and microsystem technologies, and there is a strong fit working together with DuPont. Advanced materials will create new and faster routes to the most desirable destinations along fabricators technology roadmaps."

Fraunhofer will provide applications expertise and fabrication capability to allow DuPont and DuPont customers to develop and demonstrate process and material integration in areas such as bond pad redistribution, wafer bumping and wafer bonding, as well as process aids for cleaning and wafer protection during processing. Fraunhofer will also support DuPont's new product development efforts and will provide hands on training of personnel.

SOURCE: DuPont Semiconductor Packaging & Circuit Materials