The company offers its DualBeam 865 FIB/SEM with 3DCD automation designed to provide thin film head manufacturers with fast, precise, automatic, three-dimensional CD (critical dimension) measurements.
The company offers its DualBeam 865 FIB/SEM with 3DCD automation designed to provide thin film head manufacturers with fast, precise, automatic, three-dimensional CD (critical dimension) measurements. The system addresses manufacturer's needs to measure multi-layer three-dimensional structures that are difficult or impossible to see with conventional, single-layer, top-down techniques- measurements such as top pole width at the gap, notch depth after trimming, GMR width, throat height, stripe height, and stripe height offset. The system automatically ion-mills a cross section, acquires a high-resolution SEM image of the exposed face, and measures cross-sectional CDs to provide fast, precise control of the head manufacturing process.
Key to the DualBeam 865's performance is its tight integration of high-performance subsystems. Its Magnum ion column delivers more current into a smaller spot for faster milling with more precise control. Its dual-mode Hexalens electron column provides high-resolution SEM imaging for accurate, repeatable measurements. The system's unique DualBeam geometry increase throughput and milling control by providing image quality without wasted sample movement. Advanced 3DCD automation permits unattended operation for increased operator productivity. Fully compliant with the fab environment and multi-vendor yield management data systems, the DualBeam 865 integrates smoothly into existing manufacturing processes.
FEI Company, 7451 N.W. Evergreen Pkwy., Hillsboro, OR 97124-5830. Tel: 503-640-7500. Fax: 503-640-7509.
