Dual-Purpose Integrated Process Control System for Overlay Registration

Nova Measuring Instruments, Ltd.ing Instruments Ltd. announced the introduction of a new dual purpose integrated system for overlay registration measurement and macro defect inspection in the photolithography steps of semiconductor manufacturing processes.

The integrated system is based on a platform developed by the Company and the extensive field experience Nova has gained in the Integrated Metrology environment during the past six years.

The system, designed for integration on a Photoresist Track, incorporates two monitoring capabilities related to the photolithography process: Mask Overlay Registration, and automated full wafer Macro Defect Inspection. The system measures the standard Overlay Registration target in multi sites on a wafer with a repeatability of 3nm (3 sigma), enabling fully automated measurement, without any human intervention, while improving the effective throughput. The system measures in parallel to processing other wafers, therefore does not affect the Lithography cell throughput time. The Macro Defect Inspection is designed to detect defects down to 40 microns. Inspection is enabled with a unique whole wafer inspection method. The system detects particles, coat and develop related defects, and EBR faults. It improves the automation of the critical photolithography operation, contributes to the overall productivity of the fab, and improves yield and cycle time.

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