Dual Chamber Spin-Processing System
Source: SEZ America, Inc.
The company offers a new spin-processing system designed to meet next-generation requirements for high throughput cleaning and film removal applications for semiconductor wafer processing.
The company offers a new spin-processing system designed to meet next-generation requirements for high throughput cleaning and film removal applications for semiconductor wafer processing. Called the Spin-Processor 223, the system utilizes dual processing chambers and a small footprint design.
The Spin-Processor 223 can process 80 or more wafers per hour and use up to three chemistries, effectively doubling previous spin-processing capabilities and matching the throughput of copper deposition tools. Additionally, the system uses 20 percent less fab floor space than two single chamber spin-processors and costs nearly 30 percent less.
The system platform works with the company's current applications including high-volume semiconductor production operations. This includes backside, bevel/edge and frontside exclusion zone copper decontamination, pre-clean for advanced lithography applications and frontside film removal applications.
SEZ America, Inc., 4824 S. 40th St., Phoenix, AZ 85040. Tel: 602-437-5050. Fax: 602-437-4949.