Product/Service

DS-4000 Speedstar

Source: Laurier, Inc.
SpeedStar's sleek design, lean footprint and sophisticated engineering contradict its exceedingly low price, based on cost per placement.
Delivers the lowest cost per die placement in the industry

SpeedStar's sleek design, lean footprint and sophisticated engineering contradict its exceedingly low price, based on cost per placement.

Unmatched Flexibility
Input Handles wafers up to 200mm (8"), waffle packs, GEL-PAKs, JEDEC trays, tape and reel, custom carriers. Also silicon, Gas, chip scale packages, flip chips, MEMS, BGAs, and more.

Output - Waffle packs, GEL-PAKs, film frames and hoops, JEDEC trays, tape and reel, custom carriers

Workhorse Speed
Throughput from 2400-3500 uph, with/without die inverting

Small Die to Big Die
Die size capability from 0.2mm (0.008") up to 25.4mm (1.000")

Flawless Accuracy
Placement within ±25µm (±0.001") on all die sizes

Lightning Changeovers
Simple product changeovers slice downtime

Invert/Non-Invert Capability

Smaller Footprint

Ergonomic Design

Proprietary Laurier Software

Meets CE Mark and SEMI S2 and S8 Specs


SpeedStar is a trademark of Laurier Incorporated
GEL-PAK is a trademark of GEL-PAK LLC.

Laurier, Inc., 10 Tinker Avenue, Londonderry, NH 03053. Tel: 603-626-4700; Fax: 603-626-4242.