Dry Clean Solution for Photoresist and Residue Removal Processes
The PEP Iridia module is the first in a series of solutions targeting the growing market for application-specific photoresist removal and wafer cleaning steps. It is capable of performing both photoresist and residue removal in a single chamber. A dry plasma source offers damage-free, residue-free process results that reduce or even eliminate wet clean steps.
This dry process module is designed to offer a lower cost of ownership than wet chemistries for applications such as post-implant resist and post-etch residue removal-frequently the determining factor in selecting dry clean alternatives over wet chemistries for certain integrated circuit (IC) manufacturing applications.
This module can be configured with or without high-temperature lamps and with either oxygen-compatible or fluorine-compatible materials. It is available on the PEP platform and is field-retrofittable. It is fully extendible to 300 mm technology.
GaSonics International, 2730 Junction Ave., San Jose, CA 95134-1909. Tel: 800-444-3963. Fax: 408-570-7530.