Product/Service

Dielectric HDP Solutions

Source: Novellus Systems Inc.
High-density plasma (HDP) CVD provides void-free gap fill of high-quality dielectric films in high aspect ratio device structures
Novellus Systems Inc.llus' high-density plasma (HDP) CVD provides void-free gap fill of high-quality dielectric films in high aspect ratio device structures. Novellus' HDP solution is distinguished by its superior film quality, coupled with a unique source design that prevents device damage and provides improved particle control.

Concept Two SPEED
SPEED's hemispherical source delivers superior throughput and device manufacturability. The hemispherical source features a single excitation frequency and a single coil.

Concept Two SPEED/SEQUEL
The integrated SPEED/SEQUEL solution combines two SPEED HDP chambers with one SEQUEL chamber to provide a high-throughput integrated intermetal dielectric solution suited for sub-0.35 micron devices.

Concept Three SPEED
The SPEED system's proprietary hemispherical ion source and bi-polar electrostatic chuck provide superior ion uniformity and temperature control. Due to inherent source design characteristics, ion uniformity remains unchanged as tool elements are scaled up for 300mm. With an optimized gas delivery system, the overall within-wafer uniformity has been improved.

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