Product/Service

Dielectric Etch System

Source: Applied Materials, Inc.
The Dielectric Etch Super e Centura provides customers with unmatched productivity and the leading-edge process performance required for a wide range of dielectric etch applications.
The Dielectric Etch Super e Centura provides customers with unmatched productivity and the leading-edge process performance required for a wide range of dielectric etch applications.

It features a high-power RF system for higher etch rates and enhanced wafer handling to produce throughputs of up to 110 wafers per hour. These enhancements ensure maximum output with a minimum number of systems, enabling customers to reduce their manufacturing costs. Critical dimension (CD) uniformity, which is key to consistent device performance, has been enhanced by a new ceramic electrostatic chuck, achieving less than ± 10 nm bias variation for 0.18 micron devices.

The Super e addresses a wide range of dielectric applications including advanced metal vias, contact etch, mask open, pad and spacer etch. The Dielectric Etch Super e Centura, combined with the company's Dielectric Etch IPS, provide Total Solutions for all current and emerging dielectric etch applications.

The Super e chamber is available on the Centura and Etch Centura II platforms.

Applied Materials, 3050 Bowers Ave., Santa Clara, CA 95054. Tel: 408-727-5555. Fax: 408-986-8352.