DEKTAK V 300-SL FOUP Surface Profiler

The DEKTAK V 300-SL FOUP surface profiler has a front opening unified pod (FOUP). This metrology system enables process monitoring of semiconductor wafers up to 300mm in a fully automated environment. The modular design incorporates cleanroom engineering with robotic handling and SECS/GEM communications with HSMS remote control operation.

High precision, stylus-based measurement technology delivers step height repeatability for monitoring etch and deposition process uniformity, as well as long scan capabilities for measuring CMP planarity or thin film stress on wafers. The linear encoded sample stage with 0.25 micro m resolution, along with a versatile pattern recognition system for automatic alignment, ensures the industry's best sample positioning repeatability and high throughput.

The first profiler with FOUP was delivered in Q1 '98 to SEMICONDUCTOR 300, the Siemens/Motorola joint venture in Dresden, Germany, the world's first production 300mm wafer fab. Another unit was installed at the i300i SEMATECH cleanroom in Austin, TX in the third quarter of 1998, following a yearlong evaluation of the DEKTAK V 300-Si manual system.

Additional profiler features include the SoftScan 2 low inertia sensor which enables low force, low noise scanning for in-line, non-destructive measurements on product wafers. Integrated vibration isolation platform and acoustical noise dampening further enhance measurement repeatability. An extensive software library also is available to provide in-depth analysis of surface profile data, including the Dek-Map 2 surface-imaging program which displays wafer topography as photo-realistic 3D renderings and enables 3D surface area analysis.

Veeco Metrology Group, 602 E. Montecito St., Santa Barbara, CA 93103. Contact: Tim Ballinger, 805-963-4431 x 208; Fax: 805-965-0522.