Product/Service

DCP 200X Dry Chemical Polishing

Source: SpeedFam-IPEC Corp.
The SpeedFam-IPEC Dry Chemical Polishing System polishes silicon wafers without pads, slurries or abrasives. It

The SpeedFam-IPEC Dry Chemical Polishing System polishes silicon wafers without pads, slurries or abrasives. It polishes wafers to meet 0.07 design rules.

  • The wafers can be single or double sided polished.
  • Fully automatic dry in dry out cassette to cassette polishing system.
  • Introduces no damage to polish and wafer surface.
  • Geometry yielded 100%.
  • Introduce no damage to polish surface.
  • Maintains input surface finish.

Throughput:
2 Chambers - 34x200mm wafers
3 Chambers - 40x200mm wafers

Tolerances:
GBIR - 0.3 micron (average) on 200mm wafers
SFQR - 0.07 micron max on 200mm wafers

SpeedFam-IPEC Corp., 405 North 54th St., Chandler, AZ 85226. Tel: 480-961-1600; Fax: 480-705-2733.