CyberOptics Sponsors ASMC 2008 Session On Optimizing Semiconductor Equipment Productivity
The challenges of current and future semiconductor process technologies require a higher level of equipment reliability, quality, repeatability and productivity in order to maximize yield. As a result, tool manufacturers and fabs are in critical need of new and innovative approaches for ensuring that equipment is operating at ideal parameters.
CSI is sponsoring the session on equipment productivity because of its commitment to the future of the semiconductor industry, and because it is deeply involved in the development of cost-effective precision wireless metrology tools for 200mm and 300mm semiconductor equipment designed to significantly reduce machine downtime, minimize wafer costs and maximize yield.
Among the presentations in Session 8 that focus on fab productivity improvements are:
- A quality-Cost Model of In-Line Inspections for Excursion Detection and Reduction by ON Semiconductor
- Design for Maintenance, presented by BlueShift Technologies
- Minimizing Charging Potential during Passivation Etch, by Systems on Silicon Manufacturing
- Optimizing the Operating Curve: How Every Fab Can Maximize its Performance, presented by Cypress Semiconductor and Portland State University
SOURCE: CyberOptics Semiconductor