Copper Electrolytes

Shipley Company offers a line of electroplating chemicals for advanced copper interconnect processes- the first specifically designed and manufactured for the microelectrics industry.

Part of the MOSAIC product family for dual damascene interconnects, the new line includes two series of electrolytes customized for different equipment configurations. The Nanoplate 2001 series is designed for use exclusively with Semitool plating equipment and the Ultrafill 2001 is optimized for Novellus tools but can also be used with other plating equipment. Each series includes an electrolyte solution with a suppressor and an additive to enhance fill performance.

Both new electrolytes provide consistent, seamless filling of submicron trenches and vias, with demonstrated capabilities of bottom up plating on features of less than 0.15 microns and aspect ratios of greater than 7:1. The electrolyte products are filtered to 0.1 microns to ensure the utmost purity and lowest possible contamination levels.

Shipley's electrolytes are designed and tested to work optimally with other materials in the MOSAIC family necessary to achieve a successful data damascene copper plating process.

Shipley Company, 455 Forest St., Marlborough, MA 01752-3001. Tel: 508-481-7950. Fax: 508-485-9113.