Coplanarity Inspection System Checks Components in JEDEC Trays at 5,000/hr


The AutoScan 8000 uses parallel hardware and multiplexed threaded software eliminating most of the dead time for the inspection module, and allows processing of different package types in parallel. By placing the inspection module between two independent pick and place modules, the user can double the output without adding the cost of a second inspection module. Parallel hardware keeps the cost of ownership lower by reducing spare parts, maintenance, operator training time, and initial cost.
To maintain a high rate of speed, sorting of rejects is done after inspection by a third Pick and Place Module located in the back of the machine. The AutoScan 8000 can be programmed to fill reject pockets with good devices or leave these pockets empty during the sort process.
The AutoScan 8000 employs the lead scanning technology of Scanner Technologies Corporation. Scanner Technologies offers two models of inspection modules. The Ultra Vim is capable of inspecting Gull Wing and J-lead devices with 3D technology. The Ultra Vim Plus Inspection Module is capable of 3D Ball Grid Array Inspection as well as the Gull Wing and J-lead capability of the standard Ultra Vim.
Exatron, 2842 Aiello Drive, San Jose, CA 95111. Phone: 408-629-7600 or 800-EXATRON (392-8766) Email: info@exatron.com