Cookson Semiconductor Packaging Materials, A Cookson Electronics Company

Cookson Semiconductor Packaging Materials (CSPM), a Cookson Electronics Company, headquartered in Alpharetta, GA, is the world leader in the development, manufacturing and sales of innovative materials used in the manufacturing of BGA, CSP and Flip Chip semiconductor packages. CSPM's products include: PLASKON brand epoxy molding compounds; area array solder products, including spheres, pastes and BGA flux; STAYSTIK thermoplastic adhesives, STAYDRY getter materials, STAYCHIP underfills and encapsulants and POLYSOLDER conductive adhesives.

CSPM is the business unit within Alpha-Fry Technologies that is totally focused on the needs of the semiconductor packaging industry. Alpha-Fry Technologies represents the materials sector within Cookson Electronics. The division's other three sectors include Speedline Technologies (focused on equipment, with leading brand names like MPM, Electrovert, Camalot, Accel and SCS), Polyclad Technologies (focused on laminates and chemistries for the PCB fabrication industry, Including the Enthone business) and Cookson Performance Solutions (focused on training and consulting services).