Comprehensive Defect Inspection Solution For 0.13/0.10-Micron Technologies

KLA-TencorCorp. has unveiled its new comprehensive defect inspection solution that delivers high throughput and industry-leading sensitivity for advanced semiconductor processing at the 0.13- and 0.10-micron nodes. Incorporating in e-beam, ultraviolet (UV) brightfield and darkfield technologies, respectively, KLA-Tencor's eS20XP, 2350 and AIT III inspection tools provide the capability to identify all the critical defects associated with the new processes and materials required to produce today's leading-edge devices.

eS20XP E-Beam Inspection: The tool has the sensitivity to detect physical defects smaller than 100 nm. Vustomers can now inspect process layers, such as silicon on insulator and low-k dielectrics, which previously could not be inspected due to charging issues.

2350 Brightfield Inspection: The inspection tool is the only UV tool that features ultra-broadband brightfield illumination to enable the resolution of circuit patterns and defects for 0.13-micron production and 0.10-micron development applications. The 2350 also includes new optical modes that provide superior noise suppression and contrast enhancements on back end of line (BEOL) metal and lithography layers.

AIT III Darkfield Inspection: The AIT III tool delivers high-throughput darkfield inspection with the increased sensitivity needed for 0.13-micron production. Ideal for film and CMP production tool monitoring applications, the AIT III provides superior defect capture by suppressing color variation and grain noise. It also provides surface selectivity to minimize detection of previous layer defects.

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