CMS System

Kurt J. Lesker CompanySystem incorporates load lock module, substrate platen assembly, sputter source assemblies, process gas module and system control options in a body consisting of a 304 stainless steel chamber mounted on a heavy-duty frame beside an instrument rack. The chamber measures 18in diameter by 15in height. It includes an o-ring sealed top plate for easy access to the chamber's inside; an eight inch CF viewport with replaceable shield, and three rotatable source ports.

The load lock module features a low profile design with integrated fast entry door. A mechanical pump and turbomolecular pump prepare the load while a rack-and-pinion transfer allows movement of samples.

From the load lock the samples enter the substrate platen assembly which allows rotation up to 40 rpm of six inch or smaller substrates. It includes RF or DC bias, heating components for temperatures up to 800°C, and a motorized top plate hoist.

Directly under the substrate assembly up to three Torus Magnetron sputtering cathodes provide uniform deposition in radial, sputter-up orientation. The guns (cathodes) can sputter magnetic or nonmagnetic materials; perform reactive sputtering; and work with RF, DC, or pulsed DC power. With the guns the sputter source assembly includes integrated gas injection, integrated source shutters for sputter deposition.

The process gas module controls the integrated gas injection with upstream or downstream pressure control options. It offers up to four channels of mass-flow control and an optional gas dispersion ring for reactive sputtering. For controlling the whole system we offer an automatic process controller, manually sequenced pneumatic valve operation, or Windows based process control.

<%=company%>, 1515 Worthington Ave., Clairton, PA 15025-2700, Phone: 1-412-233-4200, Fax: 1-412-233-4275