CMP System
The tool, a universal CMP system specifically designed for logic and application-specific integrated circuit (ASIC) applications, is a highly flexible, dry-in/dry-out CMP wafer processing system that fully integrates four independent wafer-polishing platens, cleaning capability, advanced metrology and automation.
Momentum enables simultaneous process development and production operation on a single tool, and supports "hot lot" processing without significantly impacting scheduled production. The system's platform improves productivity and provides low cost of ownership (CoO).
The system features SpeedFam-IPEC Corp.EC's new Next planarization system, a hybrid of the company's industry-proven rotational and orbital CMP capabilities.
Momentum also utilizes Adaptive Planarization Technology (APT) -- a new, front-referenced carrier technology that features a "edge-tuning" design that ensures outstanding within-wafer uniformity. It provides wafer profile control that compensates for incoming deposition issues and post-polish within-wafer uniformity to class-leading edge exclusion in copper and STI applications. Momentum's Sentinel multi-zone, broadband optical endpoint assures complete copper removal over 100 percent of the wafer surface.
<%=company%>, 305 North 54th Street, Chandler, AZ 85226, Tel: 480-961-1600, Fax: 480-705-2793