CMP System
Targeted for all CMP applications, the system is suitable for a variety of different dielectric and metal materials that include oxide, tungsten and copper. The cleaner can be configured with up to four separate process modules: a single-wafer immersion megasonic module, two double-sided brush scrubber stations and a spin rinse dryer.
For enhanced defect control, wafers are gripped at the edge and submerged vertically into the modules where they are cleaned on front and back sides. The vertical orientation and serial arrangement of the cleaning modules help minimize footprint, offer improved process performance and enable high throughput by transferring five wafers simultaneously. Contributing to the subsystem's high-speed operation and throughput, each module requires only 30 seconds of process time.
At the scrubber stations, each wafer is scrubbed twice with double-sided, high-speed brush scrubbers to loosen and remove slurry. A single-wafer megasonics bath can be added to ensure particle removal from alignment marks, very small recessed features and difficult bevel regions to offer maximum cleaning efficiency for advanced applications.
The cleaner features on-board liquid delivery modules for automatic chemical bath management and control. These mixing modules eliminate the need for external mixing cabinets. The liquid delivery modules support a variety of industry standard chemistries including HF in the brush modules and heated RCA chemistries in the megasonic module. For copper interconnects, the cleaner supports the company's proprietary ElectraClean solution that helps resist corrosion on the wafer, removes post-CMP copper particles and demonstrates low, stable defect counts.
<%=company%>, 3050 Bowers Avenue, Santa Clara, CA 95054-3299. Phone: 408-727-5555. Fax: 408-748-9943.