Product/Service

CMP Slurry Characterization

Source: Air Liquide America Corporation
An advanced CMP (Chemical Mechanical Polish) slurry characterization is being offered as an analytical service to the semiconductor industry
Air Liquide America Corporationvanced CMP (Chemical Mechanical Polish) slurry characterization is being offered as an analytical service to the semiconductor industry. The slurry characterization includes a portfolio of specific analyses:
  • Mean particle size distribution allows customers to visualize the solids distribution in their slurries.
  • Particle sizing for large-diameter particles is offered.
  • The Zeta Potential shows the state of particle agglomeration in a slurry
  • Also performed on slurries: viscosity, pH, specific gravity and percent solids measurements.
  • Titrations are useful to track the concentration of a specific chemical component within the slurry.

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