Product/Service

CMP Pads

Source: Cabot Microelectronics Corporation
The Epic family of CMP pads are designed and manufactured using an approach that enables breakthrough polishing performance in terms of CMP stability, planarity and cost of ownership
Request Information
Featured at Semicon Taiwan

The Epic family of CMP pads are designed and manufactured using an approach that enables breakthrough polishing performance in terms of CMP stability, planarity and cost of ownership. The Epic-W1 pad is designed for tungsten plug and damascene applications, and is the first in this family of Epic pads, all optimized to work with Cabot's slurries.

These pads are designed using a proprietary urethane fabrication process in which the base urethane is created in a micro-scale process eliminating inconsistencies introduced in existing, large-cake processes. This consistent and pure urethane is then molded to form a single pad thickness.

Cabot Corporation, 500 Commons Drive, Aurora, IL 60504. Tel: 630-585-9471. Fax: 630-585-9976.