Cluster Tool

Trikon TechnologiesƒxP offers a complete dielectric roadmap to 0.1µm production on a single product platform. The single-wafer cluster tool combines flexibility, productivity and technology to semiconductor manufacturers.

Trikon TechnologiesƒxP uses Trikon's patented Flowfill and Low k Flowfill technologies for standard and low k IMD dielectrics, enabling logic and DRAM manufacturers to migrate to more advanced design rules and higher speed devices without changing hardware.

Planar ƒxP takes Trikon's CVD process hardware and adds extra functionality and productivity with a wafer tansport module that delivers higher throughput density. This module uses a fast-action, robot handler, with dual end effectors, that offers three axes of movement. Two vacuum cassette loadlocks provide the interface to the fav and can easily be integrated with SMIF or other automation systems.

A wafer orient station and cool-down module, integrated within the transport module, offer comprehensive process control and compatibility with standard pastic cassettes. Six process module positions are available around the transfer module so that tool configuration can be specified to maximize throughput.

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