Chip Carrier

IBM, Microelectronics Divisionnductor packaging is designed to increase reliability for servers and networking gear that make up the backbone of the Internet. This chip package is designed to support the high-frequency, high-bandwidth requirements being driven by the Web and to provide unmatched dependability, preventing outages. Semiconductor packaging encases the chip to protect its delicate circuitry and carries data from the chip to the rest of the system via a network of wiring and materials.

Developed for manufacturers of servers and networking gear, the chip carrier (HPCC) is designed to double the field life of similar existing chip packages. In addition, its performance allows the internal chips in equipment such as routers, hubs and switches to transfer more data to the rest of the system, keeping pace with rising Web traffic and consumer demands.

This packaging offering also features a fluoropolymer dielectric material, which optimizes chip performance by speeding the flow of electrical current from the chip to the rest of the system. It is designed to support chip speeds in the gigahertz range, as well as high bandwidths. This packaging is a suitable choice for both high-speed wired and server applications.

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